Process: Hardware Development

Transforming Ideas into Market-Ready Solutions!

Your Hardware Development Partner. Rapidise offers a structured product development lifecycle tailored to hardware projects, guiding you from initial concept to market launch. Our unwavering support ensures a successful journey at every stage.

Our Process

Phase 1 Phase 2 Phase 3 Phase 4
SoW, PRD & Architecture
Schematic Design
Layout Design
Bring up & Product Delivery


SoW, PRD
& Architecture
SoW, PRD & Architecture


Schematic
Design
Schematic Design


Layout
Design
Layout Design


Bring up &
Product Delivery
Bring up & Product Delivery

SoW, PRD & Architecture

Scope of Work Finalization A BoM Finalization

  • Qualcomm
  • Synaptics
  • NXP Semiconductor
  • Nordic Semiconductor
  • Quectel
  • Macronix
  • Micron
  • SoW, PRD & Architecture

    Product Requirement Document Architecture Document

  • Winbond Electronics
  • KIOXIA America Inc.
  • Analog Devices/Maxim Integrated
  • ST Microelectronics
  • OSRAM
  • Panasonic
  • Texas Instruments
  • Phase 1

    SoW, PRD

    Product Requirement Document Architecture Document

  • TDK Corporation
  • Microchip Technology
  • Renesas
  • TE Connectivity
  • AMP Connectors
  • Molex
  • Hirose Electric Co Ltd
  • Samtec
  • Schematic Design

    Power Budget Analysis GPIO Pin Mapping

  • High Speed Digital Board Designs
  • Low Speed Digital Board Designs
  • RF and Wireless Design Solutions
  • MCU Designs
  • Schematic Design

    Schematic Library Creation Schematic Drafting

  • Power-optimized & Battery Operated Designs
  • Development Platforms
  • System-on-Modules (SoM)
  • Embedded Processor Based Designs
  • Phase 2

    Schematic

    BoM Creation & Finalization

  • Analog and Audio Circuit Designs
  • Design Estimations/ BOM Optimization
  • ADCs and DACs
  • Allegro, OrCAD, Altium, Ki-CAD
  • Layout Design

    Footprint Creation Get the PCB Stack Up

  • Library Management
  • Small Footprints
  • PCB Stack Up Design
  • Board Size and Net Count
  • Signal Integrity
  • Layout Design

    Layout Design Gerber Release

  • Power Integrity
  • Thermal Analysis
  • Power Distribution
  • EMI and EMC
  • Design Rules and Constraints
  • Phase 3

    Layout Design

    PCB Fabrication & SMT Assembly

  • Component Clearance and Mechanical Constraints
  • Design for Manufacturing (DFM) Analysis
  • Design for Assembly (DFA) Analysis
  • Design for Testing (DFT) Analysis
  • Allegro, OrCAD, Altium, Ki-CAD
  • Bring up & Product Delivery

    Test Cases Preparation & Finalization PCBA Bring Up EDVT Report

  • MIPI CSI & DSI, LVDS
  • Ethernet SGMII & RGMII
  • Ethernet PHY USB
  • PCI Express, HDMI, CAN, SATA
  • GPS, GSM, WiFi, Bluetooth, LTE, NFC
  • Touch Screen
  • Bring up & Product Delivery

    QA/QC Testing
    Final Delivery of Product

  • AMIC, DMIC, SoundWire, SLIMbus Digital Audio
  • LDDDR3ILPDDR4ILPDDR4X /LPDDR5
  • DDR2IDDR3IDDR4 SDRAM
  • SDIO, SDC, eMMC/UFS, eMCP
  • Sensors I2C, SPI, UART
  • Phase 4

    Others

    Prototype to Production Ownership
    Prototype to Production Ownership
    Prototype Development
    Prototype Development
    Manufacturing Support
    Manufacturing Support
    Quality Assurance
    Quality Assurance
    Mechanical/Enclosure Designing for Products
    Mechanical/Enclosure Designing for Products
    Design Estimation Optimization
    Design Estimation Optimization
    Supply Chain Management
    Supply Chain Management

    RFQ to FDR Rapidise Project Delivery Cycle

    Below you will discover the various stages of your Project’s Delivery Cycle, starting from a Request for Quotation (RFQ) which initiates the Product Requirement Gathering process, and ending with a Final Delivery Report, which releases all final Project Deliverables.

    Industries We Serve

    Automotive

    Security & Surveillance

    Industry 4.0  

    Consumer Electronics

    Healthcare

    Technology Marketplace

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    made HW, SW, or AI Solution

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