Process: Hardware Development
Hardware Development Lifecycle
Your Hardware Development Partner. Rapidise offers a structured product development lifecycle tailored to hardware projects, guiding you from initial concept to market launch. Our unwavering support ensures a successful journey at every stage.
Phase 1
SoW, PRD & Architecture
Scope of Work Finalization & A BoM Finalization
Qualcomm
Synaptics
NXP Semiconductor
Nordic Semiconductor
Quectel
Macronix
Micron
Product Requirement Document & Architecture Document
Winbond Electronics
KIOXIA America Inc.
Analog Devices/Maxim Integrated
ST Microelectronics
OSRAM
Panasonic
Texas Instruments
TDK Corporation
Microchip Technology
Renesas
TE Connectivity
AMP Connectors
Molex
Hirose Electric Co Ltd
Samtec
Phase 2
Schematic Design
Power Budget Analysis & GPIO Pin Mapping
High Speed Digital Board Designs
Low Speed Digital Board Designs
RF and Wireless Design Solutions
MCU Designs
Schematic Library Creation & Schematic Drafting
Power-optimized & Battery Operated Designs
Development Platforms
System-on-Modules (SoM)
Embedded Processor Based Designs
BoM Creation & Finalization
Analog and Audio Circuit Designs
Design Estimations/ BOM Optimization
ADCs and DACs
Allegro, OrCAD, Altium, Ki-CAD
Phase 3
Layout Design
Footprint Creation & Get the PCB Stack Up
Library Management
Small Footprints
PCB Stack Up Design
Board Size and Net Count
Signal Integrity
Layout Design & Gerber Release
Power Integrity
Thermal Analysis
Power Distribution
EMI and EMC
Design Rules and Constraints
PCB Fabrication & SMT Assembly
Component Clearance and Mechanical Constraints
Design for Manufacturing (DFM) Analysis
Design for Assembly (DFA) Analysis
Design for Testing (DFT) Analysis
Allegro, OrCAD, Altium, Ki-CAD
Phase 4
Bring up & Product Delivery
Test Cases Preparation, Finalization & PCBA Bring Up EDVT Report
MIPI CSI & DSI, LVDS
Ethernet SGMII & RGMII
Ethernet PHY USB
PCI Express, HDMI, CAN, SATA
GPS, GSM, WiFi, Bluetooth, LTE, NFC
Touch Screen
QA/QC Testing & Final Delivery of Product
AMIC, DMIC, SoundWire, SLIMbus Digital Audio
LDDDR3ILPDDR4ILPDDR4X /LPDDR5
DDR2IDDR3IDDR4 SDRAM
SDIO, SDC, eMMC/UFS, eMCP
Sensors I2C, SPI, UART
Phase 5
Maintain
Key Activities
Auto Scaling For Cloud Deployment
Continuous Monitoring Of Model Performance
Drift Correction Through New Dataset Addition
Drift Correction Through Hyper Parameter Tuning
Key Deliverable
Scalable Cloud Infrastructure
Up To Date Model Performance
Time
On Going
Data Source (Options)
Open Source Datasets
Commercial Datasets
Dedicated Team For Data Collection
Simulate Datasets Through Third Party Licensing Tools
RFQ to FDR Rapidise Project Delivery Cycle
Below you will discover the various stages of your Project’s Delivery Cycle, starting from a Request for Quotation (RFQ) which initiates the Product
Requirement Gathering process, and ending with a Final Delivery Report, which releases all final Proiect Deliverables.
Requirements finalization
Product Requirement Specification Phase
Finalizing requirements in an embedded project is an important step in ensuring the successful development and deployment of the system. Here are some key steps and considerations for finalizing requirements in an embedded project
Requirement Identification
Requirement Analysis
Prioritization and Classification
Requirement Traceability
Requirement Validation
Requirement Documentation
Change Management
Architecture Phase
Product Specification
Hardware Architecture
Hardware Design Limitation
Overall BOM Cost
Major Component Selection
Technical Stack
Assumption
Gray Areas
Acceptance Criteria
Risk Factors And Mitigation Plan
Block diagram
Pin Mapping
Power Budgeting
FMEA (Failure Modes and Effects Analysis)
Major Component Selection
When selecting major components for an embedded project, there are several criteria to consider.The specific criteria may vary depending on the nature of the project,but here are some common factors to evaluate:
Submitted by Client
Functional Requirements
Performance
Quality and Reliability
Availability and Longevity
Cost
Compatibility and Interoperability
Development and Support
Scalability and Flexibility
Power Efficiency
Safety and Compliance
By carefully evaluating these criteria and conducting thorough research, you can select major components that align with the project’s requirements, budget, and long-term objectives.
Schematic Design
When creating a schematic design for an embedded project, there are several criteria to consider. The schematic design is a crucial step in defining the electrical and functional aspects of the system. Here are some key criteria to keep in mind:
When selecting major components for an embedded project, there are several criteria to consider. The specific criteria may vary depending on the nature of the project, but here are some common factors to evaluate:
System Requirements
Component Selection
Signal Integrity
Power Distribution
EMI/EMC Considerations
Documentation and Clarity
Revision Control
Collaboration and Feedback
By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.
BOM Creation
When creating a Bill of Materials (BOM) for an embedded project, it is important to consider several criteria to ensure accuracy, completeness, and efficiency. The BOM provides a comprehensive list of all components required for the project, including part numbers, quantities, and other relevant details. Here are some key criteria to keep in mind when creating a BOM:
Component Information
Quantity and Units
Supplier and Pricing Information
Manufacturer and Distributor Support
Alternatives and Second Sources
Lifecycle and Obsolescence Management
BOM Version Control
By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.
BOM Creation
Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:
When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:
Component Datasheets
IPC Standards
Component Geometry
Pad Design
Solder Mask and Paste Mask
Thermal Considerations
Manufacturing Constraints
Silkscreen and Reference Designators
Verification and Validation
Documentation
Keep-out Zones
By considering these criteria during footprint design, you can create accurate and reliable footprints that ensure proper soldering, optimal electrical performance, and seamless integration of components into the PCB layout.
Component Placement
Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:
When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:
Signal Integrity
Thermal Management
Power Distribution
Iterative Optimization
Manufacturing and Assembly
Design for Testing (DFT)
Documentation and Clarity
Design Rules and Constraints
Electromagnetic Compatibility
Component Clearance and Mechanical Constraints
By considering these criteria, you can create an optimized component placement that enhances the functionality, performance, and manufacturability of the embedded system while ensuring good signal integrity, thermal management, and compliance with design and assembly requirements.
Electro mechanical verification
Electro-mechanical verification is an important process to ensure that the electrical and mechanical aspects of a product or system are properly integrated and function as intended. Here are some criteria to consider when performing electro-mechanical verification:
Dimensional Compatibility
Mechanical Stress and Strain
Electrical Connection
Electrical Grounding
EMI/EMC Compliance
Mechanical and Electrical Safety
Functional Integration
Thermal Management
Environmental Durability
Documentation and Standards Compliance
By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.
PCB Layout
When designing a PCB layout, there are several important criteria to consider to ensure the functionality, performance, manufacturability, and reliability of the printed circuit board. Here are some key criteria to keep in mind:
Component Placement
Signal Integrity
Power and Ground Planes Incorporate
Routing and Trace Considerations
Thermal Management
Design for Manufacturing (DFM)
Design for Testing (DFT)
EMI/EMC Considerations
Component and Footprint Selection
Documentation and Verification
Revision Control
By considering these criteria during the PCB layout design process, you can create a well-optimized layout that meets the project requirements, complies with industry standards, and can be efficiently manufactured and tested.
By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.
Board Bring up
The criteria for PCB board bringup typically include the following aspects:
Power Supply
Component Placement
Solder Joints
Signal Integrity
Clock and Timing
Power Integrity
Functional Testing
Thermal Management
Compliance and Standards
Hardware Firmware Integration (dump code)
The criteria for hardware-firmware integration, specifically when it comes to integrating firmware (also known as “dump code”) with hardware, typically involve the following considerations
The criteria for PCB board bringup typically include the following aspects:
Firmware Compatibility
Hardware Initialization
Communication Interfaces
Register Configuration
Peripheral Integration
Memory Management
Error Handling and Fault Tolerance
Real-Time Constraints
Integration Testing
QA/QC Testing
The criteria for Quality Assurance (QA) and Quality Control (QC) testing typically involve the following considerations:
Test Planning
Functional Testing
Performance Testing
Usability Testing
Compatibility Testing
Security Testing
Regression Testing
Stress and Load Testing
Compliance Testing
Documentation Review
Bug Tracking and Reporting
Continuous Improvement
The goal of QA/QC testing is to ensure the quality, reliability, and functionality of the product or system, providing confidence to stakeholders and end-users that it meets their expectations and requirements.
Final Testing
Final testing criteria encompass a set of considerations to ensure that the product or system is thoroughly evaluated before its release or deployment. These criteria may include:
System Integration Testing
End-to-End Testing
User Acceptance Testing (UAT)
Performance and Scalability Testing
Security and Penetration Testing
Compatibility Testing
Accessibility Testing
Regression Testing
Reliability and Stability Testing
Disaster Recovery and Backup Testing
Compliance and Certification Testing
Documentation and Release Readiness
User Feedback Incorporation
By adhering to these final testing criteria, organizations can ensure that their products or systems are thoroughly evaluated, meeting the desired quality standards, and ready for successful deployment or release to end-users.
Shipment & Release
The criteria for shipment and release of a product typically involve the following considerations:
Quality Assurance
Regulatory Compliance
Manufacturing Readiness
Inventory Management
Documentation and Manuals
Order Fulfillment
Logistics and Shipping
Export and Import Compliance
Component and Footprint Selection
Documentation and Verification
Revision Control
By considering these criteria, organizations can ensure a smooth and successful shipment and release process, delivering high-quality products to customers while meeting regulatory requirements and customer expectations.
PCB Layout
When designing a PCB layout, there are several important criteria to consider to ensure the functionality, performance, manufacturability, and reliability of the printed circuit board. Here are some key criteria to keep in mind:
Component Placement
Signal Integrity
Power and Ground Planes Incorporate
Routing and Trace Considerations
Thermal Management
Design for Manufacturing (DFM)
Design for Testing (DFT)
EMI/EMC Considerations
Component and Footprint Selection
Documentation and Verification
Revision Control
By considering these criteria during the PCB layout design process, you can create a well-optimized layout that meets the project requirements, complies with industry standards, and can be efficiently manufactured and tested.
By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.
Industries We Serve
Rapidise caters for many industries and offers specialized and unique industrial solutions within sectors. We appreciate that each industry has its strengths and weaknesses, and we tap into it to facilitate your business objectives.
Automotive
Security & Surveillance
Health Care
Consumer Electronics
Industry 4.0
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