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Edge AI Box – 12 TOPS

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Designed as an ODM solution, this Edge AI Box delivers 12 TOPS of AI processing power and supports multiple camera and display interfaces making it an ideal fit for partners looking to white label advanced edge intelligence solutions. Built on the Qualcomm® QCS8550 platform, it is engineered for scalable deployment in B2B environments such as biotech laboratories, smart manufacturing units, and industrial surveillance or security control centers. This is not a direct-to-consumer (B2C) product, but a robust platform for enterprises and system integrators seeking custom-branded AI-enabled devices.

Designed as an ODM solution, this Edge AI Box delivers 12 TOPS of AI processing power and supports multiple camera and display interfaces making it an ideal fit for partners looking to white label advanced edge intelligence solutions. Built on the Qualcomm® QCS8550 platform, it is engineered for scalable deployment in B2B environments such as biotech laboratories, smart manufacturing units, and industrial surveillance or security control centers. This is not a direct-to-consumer (B2C) product, but a robust platform for enterprises and system integrators seeking custom-branded AI-enabled devices.

Platform

Qualcomm™ QCS6490

CPU

Qualcomm® Kryo™ 670 CPU

GPU

Qualcomm® Adreno™ 643L, OpenGL® ES 3.2, DirectX® FL 12, OpenCL™ 2.0, Vulkan®

Video Performance

Adreno VPU 633

Memory/Storage

8GB LPDDR5 RAM, 128GB UFS 3.1, M.2 2280 SSD NVMe

Wireless Connectivity

Wi-Fi + BLE – Inbuilt Support for Wi-Fi & BLE, LTE – Support M.2 3042 4G/3052 (4G Module Optional)

Other Interfaces

USB, Ethernet, COM Port, DI/DO

Camera Interfaces

3 x 4-lane D-PHY Camera, 2 x GMSL

Display

1 x HDMI OUT, 1 x DP V1.4 (Over Type-C)

Audio Interfaces

1 x Speaker OUT | 1 x HDMI IN AND 1 x HDMI OUT with Audio (Over I2S interface)

Operating Environment

-30oC to +85oC

Operating System

Android OS

Mechanical Specification

SOM: 45mm x 45mm

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