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Process: Hardware Development

Data Inception To
Real-World Integration

Rapidise follows a proven Life Cycle for AI projects, encompassing all crucial stages in bringing a product to life, from ideation to market launch. At every step of the process, Rapidise provides unwavering support to ensure a successful outcome.

Our Process

Phase 1 Phase 2 Phase 3 Phase 4
SoW, PRD & Architecture
SoW, PRD & Architecture
Schematic Design
Schematic Design
Layout Design
Layout Design
Bring up & Product Delivery
Bring up & Product Delivery

SoW, PRD & Architecture

Scope of Work Finalization A BoM Finalization

  • Qualcomm
  • Synaptics
  • NXP Semiconductor
  • Nordic Semiconductor
  • Quectel
  • Macronix
  • Micron
  • SoW, PRD & Architecture

    Product Requirement Document Architecture Document

  • Winbond Electronics
  • KIOXIA America Inc.
  • Analog Devices/Maxim Integrated
  • ST Microelectronics
  • OSRAM
  • Panasonic
  • Texas Instruments
  • Phase 1
  • SoW, PRD

    Product Requirement Document Architecture Document

  • TDK Corporation
  • Microchip Technology
  • Renesas
  • TE Connectivity
  • AMP Connectors
  • Molex
  • Hirose Electric Co Ltd
  • Samtec
  • Schematic Design

    Power Budget Analysis GPIO Pin Mapping

  • High Speed Digital Board Designs
  • Low Speed Digital Board Designs
  • RF and Wireless Design Solutions
  • MCU Designs
  • Schematic Design

    Schematic Library Creation Schematic Drafting

  • Power-optimized & Battery Operated Designs
  • Development Platforms
  • System-on-Modules (SoM)
  • Embedded Processor Based Designs
  • Phase 2
  • Schematic

    BoM Creation & Finalization

  • Analog and Audio Circuit Designs
  • Design Estimations/ BOM Optimization
  • ADCs and DACs
  • Allegro, OrCAD, Altium, Ki-CAD
  • Layout Design

    Footprint Creation Get the PCB Stack Up

  • Library Management
  • Small Footprints
  • PCB Stack Up Design
  • Board Size and Net Count
  • Signal Integrity
  • Layout Design

    Layout Design Gerber Release

  • Power Integrity
  • Thermal Analysis
  • Power Distribution
  • EMI and EMC
  • Design Rules and Constraints
  • Phase 3
  • Layout Design

    PCB Fabrication & SMT Assembly

  • Component Clearance and Mechanical Constraints
  • Design for Manufacturing (DFM) Analysis
  • Design for Assembly (DFA) Analysis
  • Design for Testing (DFT) Analysis
  • Allegro, OrCAD, Altium, Ki-CAD
  • Bring up & Product Delivery

    Test Cases Preparation & Finalization PCBA Bring Up EDVT Report

  • MIPI CSI & DSI, LVDS
  • Ethernet SGMII & RGMII
  • Ethernet PHY USB
  • PCI Express, HDMI, CAN, SATA
  • GPS, GSM, WiFi, Bluetooth, LTE, NFC
  • Touch Screen
  • Bring up & Product Delivery

    QA/QC Testing
    Final Delivery of Product

  • AMIC, DMIC, SoundWire, SLIMbus Digital Audio
  • LDDDR3ILPDDR4ILPDDR4X /LPDDR5
  • DDR2IDDR3IDDR4 SDRAM
  • SDIO, SDC, eMMC/UFS, eMCP
  • Sensors I2C, SPI, UART
  • Phase 4
  • Others

    Design Estimation Optimization
    Design Estimation Optimization
    Prototype Development
    Prototype Development
    Manufacturing Support
    Manufacturing Support
    Quality Assurance
    Quality Assurance
    Whitebox / Blackbox Testing, etc.
    Whitebox / Blackbox Testing, etc.
    Power Optimization Algorithms
    Power Optimization Algorithms
    Cross Talk Removal
    Cross Talk Removal

    RFQ to FDR Rapidise Project Delivery Cycle

    Within your Project’s Delivery Cycle, the journey begins with a Request for Quotation (RFQ), sparking the Product Requirement Gathering phase. It progresses through various stages, culminating in the issuance of a Final Delivery Report, marking the comprehensive release of all project deliverables

    01

    02

    03

    04

    05

    06

    07

    08

    09

    10

    11

    12

    13

    14

    Requirements finalization

    Product Requirement Specification Phase

    Finalizing requirements in an embedded project is an important step in ensuring the successful development and deployment of the system. Here are some key steps and considerations for finalizing requirements in an embedded project:

    • Requirement Identification
    • Requirement Analysis
    • Prioritization and Classification
    • Requirement Traceability
    • Requirement Validation
    • Requirement Documentation
    • Change Management

    Architecture Phase

    • Product Specification
    • Hardware Architecture
    • Hardware Design Limitation
    • Overall BOM Cost
    • Major Component Selection
    • Technical Stack
    • Assumption
    • Gray Areas
    • Acceptance Criteria
    • Risk Factors And Mitigation Plan
    • Block diagram
    • Pin Mapping
    • Power Budgeting
    • FMEA (Failure Modes and Effects Analysis)

    Major Component Selection

    When selecting major components for an embedded project, there are several criteria to consider. The specific criteria may vary depending on the nature of the project, but here are some common factors to evaluate:

    • Functional Requirements
    • Performance
    • Quality and Reliability
    • Availability and Longevity
    • Cost
    • Compatibility and Interoperability
    • Development and Support
    • Scalability and Flexibility
    • Power Efficiency
    • Safety and Compliance

    By carefully evaluating these criteria and conducting thorough research, you can select major components that align with the project’s requirements, budget, and long-term objectives.

    Schematic Design

    When creating a schematic design for an embedded project, there are several criteria to consider. The schematic design is a crucial step in defining the electrical and functional aspects of the system. Here are some key criteria to keep in mind:

    When selecting major components for an embedded project, there are several criteria to consider. The specific criteria may vary depending on the nature of the project, but here are some common factors to evaluate:

    • System Requirements
    • Component Selection
    • Signal Integrity
    • Power Distribution
    • EMI/EMC Considerations
    • Documentation and Clarity
    • Revision Control
    • Collaboration and Feedback

    By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.

    BOM Creation

    When creating a Bill of Materials (BOM) for an embedded project, it is important to consider several criteria to ensure accuracy, completeness, and efficiency. The BOM provides a comprehensive list of all components required for the project, including part numbers, quantities, and other relevant details. Here are some key criteria to keep in mind when creating a BOM:

    • Component Information
    • Quantity and Units
    • Supplier and Pricing Information
    • Manufacturer and Distributor Support
    • Alternatives and Second Sources
    • Lifecycle and Obsolescence Management
    • BOM Version Control

    By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.

    BOM Creation

    Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:

    When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:

    • Component Datasheets
    • IPC Standards
    • Component Geometry
    • Pad Design
    • Solder Mask and Paste Mask
    • Keep-out Zones
    • Thermal Considerations
    • Manufacturing Constraints
    • Silkscreen and Reference Designators
    • Verification and Validation
    • Documentation

    By considering these criteria during footprint design, you can create accurate and reliable footprints that ensure proper soldering, optimal electrical performance, and seamless integration of components into the PCB layout.

    Component Placement

    Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:

    When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:

    • Signal Integrity
    • Thermal Management
    • Power Distribution
    • Iterative Optimization
    • Manufacturing and Assembly
    • Design for Testing (DFT)
    • Documentation and Clarity
    • Design Rules and Constraints
    • Component Clearance and Mechanical Constraints
    • Electromagnetic Compatibility (EMC)

    By considering these criteria, you can create an optimized component placement that enhances the functionality, performance, and manufacturability of the embedded system while ensuring good signal integrity, thermal management, and compliance with design and assembly requirements.

    Electro mechanical verification

    Electro-mechanical verification is an important process to ensure that the electrical and mechanical aspects of a product or system are properly integrated and function as intended. Here are some criteria to consider when performing electro-mechanical verification:

    • Dimensional Compatibility
    • Mechanical Stress and Strain
    • Electrical Connection
    • Electrical Grounding
    • EMI/EMC Compliance
    • Thermal Management
    • Mechanical and Electrical Safety
    • Functional Integration
    • Environmental Durability
    • Documentation and Standards Compliance

    By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.

    PCB Layout

    When designing a PCB layout, there are several important criteria to consider to ensure the functionality, performance, manufacturability, and reliability of the printed circuit board. Here are some key criteria to keep in mind:

    • Component Placement
    • Signal Integrity
    • Power and Ground Planes Incorporate
    • Routing and Trace Considerations
    • Thermal Management
    • Design for Manufacturing (DFM)
    • Design for Testing (DFT)
    • EMI/EMC Considerations
    • Component and Footprint Selection
    • Documentation and Verification
    • Revision Control

    By carefully evaluating these criteria and conducting thorough research, you can select major components that align with the project’s requirements, budget, and long-term objectives.

    By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.

    Board Bring up

    The criteria for PCB board bringup typically include the following aspects:

    • Power Supply
    • Component Placement
    • Solder Joints
    • Signal Integrity
    • Clock and Timing
    • Power Integrity
    • Functional Testing
    • Thermal Management
    • Compliance and Standards

    Hardware Firmware Integration (dump code)

    The criteria for hardware-firmware integration, specifically when it comes to integrating firmware (also known as “dump code”) with hardware, typically involve the following considerations

    The criteria for PCB board bringup typically include the following aspects:

    • Firmware Compatibility
    • Hardware Initialization
    • Communication Interfaces
    • Register Configuration
    • Peripheral Integration
    • Memory Management
    • Error Handling and Fault Tolerance
    • Real-Time Constraints
    • Integration Testing

    QA/QC Testing

    The criteria for Quality Assurance (QA) and Quality Control (QC) testing typically involve the following considerations:

    • Test Planning
    • Functional Testing
    • Performance Testing
    • Usability Testing
    • Compatibility Testing
    • Security Testing
    • Regression Testing
    • Stress and Load Testing
    • Error Handling and Exception Testing
    • Compliance Testing
    • Documentation Review
    • Bug Tracking and Reporting
    • Continuous Improvement

    The goal of QA/QC testing is to ensure the quality, reliability, and functionality of the product or system, providing confidence to stakeholders and end-users that it meets their expectations and requirements.

    Final Testing

    Final testing criteria encompass a set of considerations to ensure that the product or system is thoroughly evaluated before its release or deployment. These criteria may include:

    • System Integration Testing
    • End-to-End Testing
    • User Acceptance Testing (UAT)
    • Performance and Scalability Testing
    • Security and Penetration Testing
    • Compatibility Testing
    • Localization and Internationalization Testing
    • Accessibility Testing
    • Regression Testing
    • Reliability and Stability Testing
    • Disaster Recovery and Backup Testing
    • Compliance and Certification Testing
    • Documentation and Release Readiness
    • User Feedback Incorporation

    By adhering to these final testing criteria, organizations can ensure that their products or systems are thoroughly evaluated, meeting the desired quality standards, and ready for successful deployment or release to end-users.

    Shipment & Release

    The criteria for shipment and release of a product typically involve the following considerations:

    • Quality Assurance
    • Regulatory Compliance
    • Manufacturing Readiness
    • Inventory Management
    • Packaging and Labeling
    • Documentation and Manuals
    • Order Fulfillment
    • Logistics and Shipping
    • Export and Import Compliance
    • Customer Support Readiness
    • Feedback and Continuous Improvement

    By considering these criteria, organizations can ensure a smooth and successful shipment and release process, delivering high-quality products to customers while meeting regulatory requirements and customer expectations.

    Deployment and Support

    The criteria for deployment and support of a product or system typically involve the following considerations:

    • Deployment Planning
    • Installation and Configuration
    • Compatibility and Integration
    • User Training
    • Data Migration
    • System Performance Monitoring
    • Technical Support and Helpdesk
    • Bug Fixing and Updates
    • Documentation and Knowledge Base
    • Continuous Monitoring and Improvement
    • Security Updates and Vulnerability Management
    • Customer Relationship Management
    • End-of-Life Planning

    By considering these deployment and support criteria, organizations can effectively deploy their products or systems, provide reliable customer support, and ensure customer satisfaction throughout the product life cycle.

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    WordPress Participant

    RFQ to FDR Rapidise Project Delivery Cycle

    Within your Project’s Delivery Cycle, the journey begins with a Request for Quotation (RFQ), sparking the Product Requirement Gathering phase. It progresses through various stages, culminating in the issuance of a Final Delivery Report, marking the comprehensive release of all project deliverables
    01
    Requirements finalization
    Product Requirement Specification Phase
    Finalizing requirements in an embedded project is an important step in ensuring the successful development and deployment of the system. Here are some key steps and considerations for finalizing requirements in an embedded project:
    • Requirement Identification
    • Requirement Analysis
    • Prioritization and Classification
    • Requirement Traceability
    • Requirement Validation
    • Requirement Documentation
    • Change Management
    Architecture Phase
    • Product Specification
    • Hardware Architecture
    • Hardware Design Limitation
    • Overall BOM Cost
    • Major Component Selection
    • Technical Stack
    • Assumption
    • Gray Areas
    • Acceptance Criteria
    • Risk Factors And Mitigation Plan
    • Block diagram
    • Pin Mapping
    • Power Budgeting
    • FMEA (Failure Modes and Effects Analysis)
    02
    Major Component Selection
    When selecting major components for an embedded project, there are several criteria to consider. The specific criteria may vary depending on the nature of the project, but here are some common factors to evaluate:
    • Functional Requirements
    • Performance
    • Quality and Reliability
    • Availability and Longevity
    • Cost
    • Compatibility and Interoperability
    • Development and Support
    • Scalability and Flexibility
    • Power Efficiency
    • Safety and Compliance
    By carefully evaluating these criteria and conducting thorough research, you can select major components that align with the project’s requirements, budget, and long-term objectives.
    03
    Schematic Design
    When creating a schematic design for an embedded project, there are several criteria to consider. The schematic design is a crucial step in defining the electrical and functional aspects of the system. Here are some key criteria to keep in mind:
    When selecting major components for an embedded project, there are several criteria to consider. The specific criteria may vary depending on the nature of the project, but here are some common factors to evaluate:
    • System Requirements
    • Component Selection
    • Signal Integrity
    • Power Distribution
    • EMI/EMC Considerations
    • Documentation and Clarity
    • Revision Control
    • Collaboration and Feedback
    By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.
    04
    BOM Creation
    When creating a Bill of Materials (BOM) for an embedded project, it is important to consider several criteria to ensure accuracy, completeness, and efficiency. The BOM provides a comprehensive list of all components required for the project, including part numbers, quantities, and other relevant details. Here are some key criteria to keep in mind when creating a BOM:
    • Component Information
    • Quantity and Units
    • Supplier and Pricing Information
    • Manufacturer and Distributor Support
    • Alternatives and Second Sources
    • Lifecycle and Obsolescence Management
    • BOM Version Control
    By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.
    05
    BOM Creation
    Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:
    When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:
    • Component Datasheets
    • IPC Standards
    • Component Geometry
    • Pad Design
    • Solder Mask and Paste Mask
    • Keep-out Zones
    • Thermal Considerations
    • Manufacturing Constraints
    • Silkscreen and Reference Designators
    • Verification and Validation
    • Documentation
    By considering these criteria during footprint design, you can create accurate and reliable footprints that ensure proper soldering, optimal electrical performance, and seamless integration of components into the PCB layout.
    06
    Component Placement
    Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:
    When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:
    • Signal Integrity
    • Thermal Management
    • Power Distribution
    • Iterative Optimization
    • Manufacturing and Assembly
    • Design for Testing (DFT)
    • Documentation and Clarity
    • Design Rules and Constraints
    • Component Clearance and Mechanical Constraints
    • Electromagnetic Compatibility (EMC)
    By considering these criteria, you can create an optimized component placement that enhances the functionality, performance, and manufacturability of the embedded system while ensuring good signal integrity, thermal management, and compliance with design and assembly requirements.
    07
    Electro mechanical verification
    Electro-mechanical verification is an important process to ensure that the electrical and mechanical aspects of a product or system are properly integrated and function as intended. Here are some criteria to consider when performing electro-mechanical verification:
    • Dimensional Compatibility
    • Mechanical Stress and Strain
    • Electrical Connection
    • Electrical Grounding
    • EMI/EMC Compliance
    • Thermal Management
    • Mechanical and Electrical Safety
    • Functional Integration
    • Environmental Durability
    • Documentation and Standards Compliance
    By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.
    08
    PCB Layout
    When designing a PCB layout, there are several important criteria to consider to ensure the functionality, performance, manufacturability, and reliability of the printed circuit board. Here are some key criteria to keep in mind:
    • Component Placement
    • Signal Integrity
    • Power and Ground Planes Incorporate
    • Routing and Trace Considerations
    • Thermal Management
    • Design for Manufacturing (DFM)
    • Design for Testing (DFT)
    • EMI/EMC Considerations
    • Component and Footprint Selection
    • Documentation and Verification
    • Revision Control
    By carefully evaluating these criteria and conducting thorough research, you can select major components that align with the project’s requirements, budget, and long-term objectives.
    By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.
    09
    Board Bring up
    The criteria for PCB board bringup typically include the following aspects:
    • Power Supply
    • Component Placement
    • Solder Joints
    • Signal Integrity
    • Clock and Timing
    • Power Integrity
    • Functional Testing
    • Thermal Management
    • Compliance and Standards
    10
    Hardware Firmware Integration (dump code)
    The criteria for hardware-firmware integration, specifically when it comes to integrating firmware (also known as “dump code”) with hardware, typically involve the following considerations
    The criteria for PCB board bringup typically include the following aspects:
    • Firmware Compatibility
    • Hardware Initialization
    • Communication Interfaces
    • Register Configuration
    • Peripheral Integration
    • Memory Management
    • Error Handling and Fault Tolerance
    • Real-Time Constraints
    • Integration Testing
    11
    QA/QC Testing
    The criteria for Quality Assurance (QA) and Quality Control (QC) testing typically involve the following considerations:
    • Test Planning
    • Functional Testing
    • Performance Testing
    • Usability Testing
    • Compatibility Testing
    • Security Testing
    • Regression Testing
    • Stress and Load Testing
    • Error Handling and Exception Testing
    • Compliance Testing
    • Documentation Review
    • Bug Tracking and Reporting
    • Continuous Improvement
    The goal of QA/QC testing is to ensure the quality, reliability, and functionality of the product or system, providing confidence to stakeholders and end-users that it meets their expectations and requirements.
    12
    Final Testing
    Final testing criteria encompass a set of considerations to ensure that the product or system is thoroughly evaluated before its release or deployment. These criteria may include:
    • System Integration Testing
    • End-to-End Testing
    • User Acceptance Testing (UAT)
    • Performance and Scalability Testing
    • Security and Penetration Testing
    • Compatibility Testing
    • Localization and Internationalization Testing
    • Accessibility Testing
    • Regression Testing
    • Reliability and Stability Testing
    • Disaster Recovery and Backup Testing
    • Compliance and Certification Testing
    • Documentation and Release Readiness
    • User Feedback Incorporation
    By adhering to these final testing criteria, organizations can ensure that their products or systems are thoroughly evaluated, meeting the desired quality standards, and ready for successful deployment or release to end-users.
    13
    Shipment & Release
    The criteria for shipment and release of a product typically involve the following considerations:
    • Quality Assurance
    • Regulatory Compliance
    • Manufacturing Readiness
    • Inventory Management
    • Packaging and Labeling
    • Documentation and Manuals
    • Order Fulfillment
    • Logistics and Shipping
    • Export and Import Compliance
    • Customer Support Readiness
    • Feedback and Continuous Improvement
    By considering these criteria, organizations can ensure a smooth and successful shipment and release process, delivering high-quality products to customers while meeting regulatory requirements and customer expectations.
    14
    Deployment and Support
    The criteria for deployment and support of a product or system typically involve the following considerations:
    • Deployment Planning
    • Installation and Configuration
    • Compatibility and Integration
    • User Training
    • Data Migration
    • System Performance Monitoring
    • Technical Support and Helpdesk
    • Bug Fixing and Updates
    • Documentation and Knowledge Base
    • Continuous Monitoring and Improvement
    • Security Updates and Vulnerability Management
    • Customer Relationship Management
    • End-of-Life Planning
    By considering these deployment and support criteria, organizations can effectively deploy their products or systems, provide reliable customer support, and ensure customer satisfaction throughout the product life cycle.

    Industries We Serve

    Automotive

    Security & Surveillance

    Industry 4.0  

    Consumer Electronics

    Healthcare

    Technology Marketplace

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    made HW, SW, or AI Solution

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