Data Inception To
Real-World Integration
Our Process
SoW, PRD & Architecture
Scope of Work Finalization A BoM Finalization
SoW, PRD & Architecture
Product Requirement Document Architecture Document
SoW, PRD
Product Requirement Document Architecture Document
Schematic Design
Power Budget Analysis GPIO Pin Mapping
Schematic Design
Schematic Library Creation Schematic Drafting
Schematic
BoM Creation & Finalization
Layout Design
Footprint Creation Get the PCB Stack Up
Layout Design
Layout Design Gerber Release
Layout Design
PCB Fabrication & SMT Assembly
Bring up & Product Delivery
Test Cases Preparation & Finalization PCBA Bring Up EDVT Report
Bring up & Product Delivery
QA/QC Testing
Final Delivery of Product
Others
RFQ to FDR Rapidise Project Delivery Cycle
01
02
03
04
05
06
07
08
09
10
11
12
13
14
Requirements finalization
Product Requirement Specification Phase
Finalizing requirements in an embedded project is an important step in ensuring the successful development and deployment of the system. Here are some key steps and considerations for finalizing requirements in an embedded project:
- Requirement Identification
- Requirement Analysis
- Prioritization and Classification
- Requirement Traceability
- Requirement Validation
- Requirement Documentation
- Change Management
Architecture Phase
- Product Specification
- Hardware Architecture
- Hardware Design Limitation
- Overall BOM Cost
- Major Component Selection
- Technical Stack
- Assumption
- Gray Areas
- Acceptance Criteria
- Risk Factors And Mitigation Plan
- Block diagram
- Pin Mapping
- Power Budgeting
- FMEA (Failure Modes and Effects Analysis)
Major Component Selection
When selecting major components for an embedded project, there are several criteria to consider. The specific criteria may vary depending on the nature of the project, but here are some common factors to evaluate:
- Functional Requirements
- Performance
- Quality and Reliability
- Availability and Longevity
- Cost
- Compatibility and Interoperability
- Development and Support
- Scalability and Flexibility
- Power Efficiency
- Safety and Compliance
By carefully evaluating these criteria and conducting thorough research, you can select major components that align with the project’s requirements, budget, and long-term objectives.
Schematic Design
When creating a schematic design for an embedded project, there are several criteria to consider. The schematic design is a crucial step in defining the electrical and functional aspects of the system. Here are some key criteria to keep in mind:
When selecting major components for an embedded project, there are several criteria to consider. The specific criteria may vary depending on the nature of the project, but here are some common factors to evaluate:
- System Requirements
- Component Selection
- Signal Integrity
- Power Distribution
- EMI/EMC Considerations
- Documentation and Clarity
- Revision Control
- Collaboration and Feedback
By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.
BOM Creation
When creating a Bill of Materials (BOM) for an embedded project, it is important to consider several criteria to ensure accuracy, completeness, and efficiency. The BOM provides a comprehensive list of all components required for the project, including part numbers, quantities, and other relevant details. Here are some key criteria to keep in mind when creating a BOM:
- Component Information
- Quantity and Units
- Supplier and Pricing Information
- Manufacturer and Distributor Support
- Alternatives and Second Sources
- Lifecycle and Obsolescence Management
- BOM Version Control
By considering these criteria, you can create a well-designed schematic that effectively represents the electrical aspects of your embedded project and serves as a solid foundation for further development and implementation.
BOM Creation
Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:
When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:
- Component Datasheets
- IPC Standards
- Component Geometry
- Pad Design
- Solder Mask and Paste Mask
- Keep-out Zones
- Thermal Considerations
- Manufacturing Constraints
- Silkscreen and Reference Designators
- Verification and Validation
- Documentation
By considering these criteria during footprint design, you can create accurate and reliable footprints that ensure proper soldering, optimal electrical performance, and seamless integration of components into the PCB layout.
Component Placement
Component placement plays a crucial role in the overall performance, reliability, and manufacturability of an embedded system. When considering component placement in a PCB (Printed Circuit Board) design, here are some key criteria to keep in mind:
When designing footprints for components in a PCB layout, it is important to consider several criteria to ensure accurate and reliable soldering, proper component alignment, and optimal electrical performance. Here are some key criteria to keep in mind when designing footprints:
- Signal Integrity
- Thermal Management
- Power Distribution
- Iterative Optimization
- Manufacturing and Assembly
- Design for Testing (DFT)
- Documentation and Clarity
- Design Rules and Constraints
- Component Clearance and Mechanical Constraints
- Electromagnetic Compatibility (EMC)
By considering these criteria, you can create an optimized component placement that enhances the functionality, performance, and manufacturability of the embedded system while ensuring good signal integrity, thermal management, and compliance with design and assembly requirements.
Electro mechanical verification
Electro-mechanical verification is an important process to ensure that the electrical and mechanical aspects of a product or system are properly integrated and function as intended. Here are some criteria to consider when performing electro-mechanical verification:
- Dimensional Compatibility
- Mechanical Stress and Strain
- Electrical Connection
- Electrical Grounding
- EMI/EMC Compliance
- Thermal Management
- Mechanical and Electrical Safety
- Functional Integration
- Environmental Durability
- Documentation and Standards Compliance
By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.
PCB Layout
When designing a PCB layout, there are several important criteria to consider to ensure the functionality, performance, manufacturability, and reliability of the printed circuit board. Here are some key criteria to keep in mind:
- Component Placement
- Signal Integrity
- Power and Ground Planes Incorporate
- Routing and Trace Considerations
- Thermal Management
- Design for Manufacturing (DFM)
- Design for Testing (DFT)
- EMI/EMC Considerations
- Component and Footprint Selection
- Documentation and Verification
- Revision Control
By carefully evaluating these criteria and conducting thorough research, you can select major components that align with the project’s requirements, budget, and long-term objectives.
By considering these criteria during the electro-mechanical verification process, you can ensure that the electrical and mechanical aspects of your product or system are thoroughly evaluated and meet the required performance, safety, and reliability standards.
Board Bring up
The criteria for PCB board bringup typically include the following aspects:
- Power Supply
- Component Placement
- Solder Joints
- Signal Integrity
- Clock and Timing
- Power Integrity
- Functional Testing
- Thermal Management
- Compliance and Standards
Hardware Firmware Integration (dump code)
The criteria for hardware-firmware integration, specifically when it comes to integrating firmware (also known as “dump code”) with hardware, typically involve the following considerations
The criteria for PCB board bringup typically include the following aspects:
- Firmware Compatibility
- Hardware Initialization
- Communication Interfaces
- Register Configuration
- Peripheral Integration
- Memory Management
- Error Handling and Fault Tolerance
- Real-Time Constraints
- Integration Testing
QA/QC Testing
The criteria for Quality Assurance (QA) and Quality Control (QC) testing typically involve the following considerations:
- Test Planning
- Functional Testing
- Performance Testing
- Usability Testing
- Compatibility Testing
- Security Testing
- Regression Testing
- Stress and Load Testing
- Error Handling and Exception Testing
- Compliance Testing
- Documentation Review
- Bug Tracking and Reporting
- Continuous Improvement
The goal of QA/QC testing is to ensure the quality, reliability, and functionality of the product or system, providing confidence to stakeholders and end-users that it meets their expectations and requirements.
Final Testing
Final testing criteria encompass a set of considerations to ensure that the product or system is thoroughly evaluated before its release or deployment. These criteria may include:
- System Integration Testing
- End-to-End Testing
- User Acceptance Testing (UAT)
- Performance and Scalability Testing
- Security and Penetration Testing
- Compatibility Testing
- Localization and Internationalization Testing
- Accessibility Testing
- Regression Testing
- Reliability and Stability Testing
- Disaster Recovery and Backup Testing
- Compliance and Certification Testing
- Documentation and Release Readiness
- User Feedback Incorporation
By adhering to these final testing criteria, organizations can ensure that their products or systems are thoroughly evaluated, meeting the desired quality standards, and ready for successful deployment or release to end-users.
Shipment & Release
The criteria for shipment and release of a product typically involve the following considerations:
- Quality Assurance
- Regulatory Compliance
- Manufacturing Readiness
- Inventory Management
- Packaging and Labeling
- Documentation and Manuals
- Order Fulfillment
- Logistics and Shipping
- Export and Import Compliance
- Customer Support Readiness
- Feedback and Continuous Improvement
By considering these criteria, organizations can ensure a smooth and successful shipment and release process, delivering high-quality products to customers while meeting regulatory requirements and customer expectations.
Deployment and Support
The criteria for deployment and support of a product or system typically involve the following considerations:
- Deployment Planning
- Installation and Configuration
- Compatibility and Integration
- User Training
- Data Migration
- System Performance Monitoring
- Technical Support and Helpdesk
- Bug Fixing and Updates
- Documentation and Knowledge Base
- Continuous Monitoring and Improvement
- Security Updates and Vulnerability Management
- Customer Relationship Management
- End-of-Life Planning
By considering these deployment and support criteria, organizations can effectively deploy their products or systems, provide reliable customer support, and ensure customer satisfaction throughout the product life cycle.
RFQ to FDR Rapidise Project Delivery Cycle
- Requirement Identification
- Requirement Analysis
- Prioritization and Classification
- Requirement Traceability
- Requirement Validation
- Requirement Documentation
- Change Management
- Product Specification
- Hardware Architecture
- Hardware Design Limitation
- Overall BOM Cost
- Major Component Selection
- Technical Stack
- Assumption
- Gray Areas
- Acceptance Criteria
- Risk Factors And Mitigation Plan
- Block diagram
- Pin Mapping
- Power Budgeting
- FMEA (Failure Modes and Effects Analysis)
- Functional Requirements
- Performance
- Quality and Reliability
- Availability and Longevity
- Cost
- Compatibility and Interoperability
- Development and Support
- Scalability and Flexibility
- Power Efficiency
- Safety and Compliance
- System Requirements
- Component Selection
- Signal Integrity
- Power Distribution
- EMI/EMC Considerations
- Documentation and Clarity
- Revision Control
- Collaboration and Feedback
- Component Information
- Quantity and Units
- Supplier and Pricing Information
- Manufacturer and Distributor Support
- Alternatives and Second Sources
- Lifecycle and Obsolescence Management
- BOM Version Control
- Component Datasheets
- IPC Standards
- Component Geometry
- Pad Design
- Solder Mask and Paste Mask
- Keep-out Zones
- Thermal Considerations
- Manufacturing Constraints
- Silkscreen and Reference Designators
- Verification and Validation
- Documentation
- Signal Integrity
- Thermal Management
- Power Distribution
- Iterative Optimization
- Manufacturing and Assembly
- Design for Testing (DFT)
- Documentation and Clarity
- Design Rules and Constraints
- Component Clearance and Mechanical Constraints
- Electromagnetic Compatibility (EMC)
- Dimensional Compatibility
- Mechanical Stress and Strain
- Electrical Connection
- Electrical Grounding
- EMI/EMC Compliance
- Thermal Management
- Mechanical and Electrical Safety
- Functional Integration
- Environmental Durability
- Documentation and Standards Compliance
- Component Placement
- Signal Integrity
- Power and Ground Planes Incorporate
- Routing and Trace Considerations
- Thermal Management
- Design for Manufacturing (DFM)
- Design for Testing (DFT)
- EMI/EMC Considerations
- Component and Footprint Selection
- Documentation and Verification
- Revision Control
- Power Supply
- Component Placement
- Solder Joints
- Signal Integrity
- Clock and Timing
- Power Integrity
- Functional Testing
- Thermal Management
- Compliance and Standards
- Firmware Compatibility
- Hardware Initialization
- Communication Interfaces
- Register Configuration
- Peripheral Integration
- Memory Management
- Error Handling and Fault Tolerance
- Real-Time Constraints
- Integration Testing
- Test Planning
- Functional Testing
- Performance Testing
- Usability Testing
- Compatibility Testing
- Security Testing
- Regression Testing
- Stress and Load Testing
- Error Handling and Exception Testing
- Compliance Testing
- Documentation Review
- Bug Tracking and Reporting
- Continuous Improvement
- System Integration Testing
- End-to-End Testing
- User Acceptance Testing (UAT)
- Performance and Scalability Testing
- Security and Penetration Testing
- Compatibility Testing
- Localization and Internationalization Testing
- Accessibility Testing
- Regression Testing
- Reliability and Stability Testing
- Disaster Recovery and Backup Testing
- Compliance and Certification Testing
- Documentation and Release Readiness
- User Feedback Incorporation
- Quality Assurance
- Regulatory Compliance
- Manufacturing Readiness
- Inventory Management
- Packaging and Labeling
- Documentation and Manuals
- Order Fulfillment
- Logistics and Shipping
- Export and Import Compliance
- Customer Support Readiness
- Feedback and Continuous Improvement
- Deployment Planning
- Installation and Configuration
- Compatibility and Integration
- User Training
- Data Migration
- System Performance Monitoring
- Technical Support and Helpdesk
- Bug Fixing and Updates
- Documentation and Knowledge Base
- Continuous Monitoring and Improvement
- Security Updates and Vulnerability Management
- Customer Relationship Management
- End-of-Life Planning
Industries We Serve
Automotive
Security & Surveillance
Industry 4.0
Consumer Electronics
Healthcare
Related services
Technology Marketplace
made HW, SW, or AI Solution